DRAM DDR4 32Gbit 16 96/144 TFBGA 2 CT

MT40A2G16TBB-062E:F – 32Gbit DDR4 SDRAM – Micron Technology TwinDie™

Optimize high-performance systems with the MT40A2G16TBB-062E:F 32Gbit DDR4 SDRAM from Micron Technology. This industrial-grade memory IC delivers exceptional bandwidth and energy efficiency for demanding computing applications. PCX supplies this reliable component with verified stock and rapid shipping.

Key Features

• Memory Size: 32Gbit (2G x 16 organization)
• Technology: DDR4 SDRAM with 1.6 GHz clock frequency
• Voltage Range: 1.14V – 1.26V (low-power operation)
• Speed: 13.75 ns access time
• Temperature Range: 0°C to 95°C (TC)
• Package: 96-TFBGA (7.5x13mm surface-mount)

Technical Specifications

This TwinDie™ memory module features a parallel interface with 16-bit data width. Engineered for high-reliability environments, it operates at industrial temperature grades while maintaining low latency. The FBGA package ensures robust performance in space-constrained designs. A comprehensive datasheet is available for download on PCXCo.com.

Typical Applications

• Data center servers and cloud infrastructure
• Enterprise networking and telecommunications equipment
• High-performance computing workstations
• Industrial automation controllers
• Embedded computing systems

About Micron Technology

Micron Technology is a global leader in advanced memory solutions, driving innovation for over 40 years. Their cutting-edge semiconductor technologies power critical infrastructure worldwide, with rigorous quality control ensuring industry-leading reliability.

Renowned for research and development excellence, Micron consistently delivers high-performance memory products optimized for next-generation applications. Their DDR4 portfolio offers proven compatibility and longevity, making them a trusted partner for industrial and enterprise solutions.

About DDR4 SDRAM

DDR4 SDRAM represents the fourth generation of double data rate synchronous dynamic RAM, offering significant improvements over previous technologies. These components provide higher module densities, increased bandwidth, and reduced power consumption – critical for modern high-speed computing.

As essential building blocks in data-intensive systems, DDR4 modules enable faster processing in servers, networking gear, and embedded devices. Their parallel interface architecture ensures efficient data transfer between processors and memory subsystems, making them indispensable for performance-critical applications across industries.

Packaging

Available in protective industry-standard trays. Contact PCX for custom packaging requirements.

Frequently Asked Questions

Q: Is this DDR4 memory backward-compatible with DDR3 systems?
A: No, DDR4 modules require compatible controllers and different physical interfaces.

Q: What does TwinDie™ technology provide?
A: Micron’s TwinDie™ stacks two dies in one package, doubling density without increasing footprint.

Q: Can this memory operate at extended temperature ranges?
A: This variant supports industrial temperatures (0°C to 95°C) – verify requirements for automotive or military specs.

Q: Does PCX provide technical support for integration?
A: Yes, our engineering team assists with datasheet interpretation and compatibility verification.

Q: How does DDR4 improve power efficiency?
A: DDR4 operates at lower voltages (1.2V typical) compared to DDR3’s 1.5V, reducing power consumption by up to 40%.

Q: Are samples available for prototyping?
A: Contact PCX sales for sampling options and minimum order quantities.

Note: Product image is representational. Refer to datasheet for exact specifications.

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