Star Quality Program

• Weigh product contents and record
• Inspect outer package for evidence of damage
• Photograph/record any findings
• Inspect the sealing tape for evidence of tampering
• If damage or evidence of tampering is present

***note findings and alert vendor and carrier for a possible freight claim

• Inspect package for any signs of damage or signs of being opened
• Photograph contents while in box if they exhibit damage, tampering, or nonconformance
• Photograph labels and sealing tape if they exhibit damage, tampering, nonconformance
• Inspect sealing tapes
• Inspect labels and verify data
• Examine the box and compare with manufacturer’s
• Scan barcode to verify information is readable

• Inspect inner contents, packaging, bag seal and labels; photograph if the exhibit damage
• Inspect bag seal
• Compare inner labels with outer carton labels and hotograph
• Verify bag seal date with product date code
• Scan the bar code to verify the information is readable and matches the product identification; record results
• Verify the product is properly packaged for the required Moisture Sensitivity Level (MSL) and comparethe MSL levelwith datasheet
• Verify the package is ESD compliant

Read and record status of Humidity Indicator Card (HIC). To test card for validity, see J-STD-033 for HIC test.

Tubes:

• If factory packaged, verify tubes are imprinted with manufacturer name/ logo
• Verify all tubes are the same length and look clean and new (not yellowed or excessively scratched)
• Verify parts in the tube are all oriented the same direction
• Verify quantity of parts in tubes is consistent
• Verify all tubes have stoppers and they are the same in each tube
• Verify labels and label placement
• Scan and verify that barcode scan and printed information on label are consistent with each other
• Verify that size of reel and the material (paper/plastic) match manufacturer spec sheet
• Verify factory reel has proper leader tape
• Verify reel count (no empty pockets) and cover film is properly attached
• Compare part orientation in tape with manufacturer spec
• Verify that there are no splices or cuts in the tape

Trays:

• Verify the color and width of the banding is what is expected
• Note if the banding has any preprinted markings
• Verify that the trays are oriented the same way
• Verify that there is a top tray to protect the parts
• Verify and record if covered by cardboard and verify if cardboard is antistatic
• Verify the chips’ orientation in the tray is consistent with no missing pieces
• Verify and record date/lot code of parts
• Verify that the date/lot code match outside packaging/label on the box, if any

Bulk:

• Verify count
• Verify the bag is correct for the type or parts received, ( i.e.. ESD or MBB)
• Verify any mfg markings on the bag against manufacturer spec sheet
• Scan and verify that barcode scan and and printed information on label are consistent with each other
• Verify and record date/lot codes

• Verify the part number, manufacturer and quantity match the purchase order and packing slip
• Verify that there is an original factory label; ensure there is not a label over label
• Confirm the manufacturer’s logo is printed on the label; inspect the spelling; the label should not be capable of being smudged
• Verify and record the country of origin, date codes, and lot codes and ensure they are consistent throughout the packaging
• Confirm the date code meets any restrictions specified on the purchase agreement
• Record any signs of damage to the product or packaging

Note: Refer to IDEA-STD-1010-B Section 10.2.1.4 for additional information on inspecting discrete components.

Visual (Section 10.3.1)

• Verify the logo and markings match the manufacturer’s specifications
  Confirm the markings are clear and do not appear to be re-marked or re-stamped
• Confirm the markings are consistent throughout the package type from part to part and on the top and bottom of the parts (placement, font type, color, and texture)
• Inspect laser marks for burn holes caused by aftermarket laser equipment
  Inspect for inconsistencies in package indents shape, size and locations
  Confirm that there are no burn or blister marks, or evidence of exposure to excessive heat
• Ensure there are no colored dots or ink marks on the tops of components indicating previous testing or programming, unless allowed or required by the purchase order
• Look for flux or chemical residue and and tool marks or heat-sink markings indicating refurbished parts
• Confirm there are no cracks on the surface of the parts
• Verify the lead/pin count and formation or type of lead (DIP, SMB, Gull Wing, etc.) match the datasheet
• Verify pins or terminal layout/count match manufacturer specs
  Inspect for damaged leads (bent, scratched, broken, dented, missing, co planarity, etc.) indicating the part has been salvaged or mishandled
• Ensure that leads are not oxidized, re-tinned with solder (re-balled for BGAs), show signs of corrosion, or contamination from foreign substances
• Look for leads that are too shiny for older date codes or too dull for new date codes; the pins should be similar in gloss or shine, color, and texture
• Confirm there are no scratches on the inside and outside of leads; scratches under the BGA spheres are typically a sign of re-balled parts
• Inspect BGAs, LGAs, and any terminals, lugs, or connectors to ensure that the component has not been used, refurbished, mishandled or contaminated
• Photograph markings front and back for records
• If nonconforming, document and photograph non-conformance (s)

Solvents (Section 10.3.2)

• Perform Device Marking Test (test for remarking– Mineral Spirits & Alcohol swab)
• Perform Device Surface Test (test for blacktopping – Acetone swab)
• Perform Scrape Test (as needed)

The Mechanical Inspection (Section 10.3.3)

• Determine the min/max or acceptable tolerance range of each measurement being taken from the mfr datasheet
• Measure, verify and record the package dimensions
• Measure for Thickness Variation