Integrated Circuits (ICs) > Embedded Processors and Controllers > Microcontrollers > NXP-Semiconductors-MPC5125YVN400
NXP Semiconductors MPC5125YVN400
| Part Number: | NXP Semiconductors MPC5125YVN400 |
| Manufacturer: | NXP Semiconductors |
| Part Type: | Integrated Circuits (ICs) > Embedded Processors and Controllers > Microcontrollers > NXP-Semiconductors-MPC5125YVN400 |
| Qty Available: | |
| Description: | MCU 32-bit MPC51xx e300 RISC ROMLess 1.4V/1.8V/2.5V/3.3V 324-Pin TE-BGA Tray |
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MCU 32-bit MPC51xx e300 RISC ROMLess 1.4V/1.8V/2.5V/3.3V 324-Pin TE-BGA Tray
Specifications
| TYPE | DESCRIPTION |
| Contact Plating | Silver, Tin |
| Mount | Surface Mount |
| Number of Pins | 324 |
| Weight | 1.713757 g |
| Data Bus Width | 32 b |
| Frequency | 400 MHz |
| Interface | CAN, EBI/EMI, Ethernet, I2C, USB |
| Max Frequency | 400 MHz |
| Max Operating Temperature | 125 °C |
| Max Supply Voltage | 1.47 V |
| Memory Size | 64 kB |
| Memory Type | ROMless |
| Min Operating Temperature | -40 °C |
| Min Supply Voltage | 1.33 V |
| Number of Ethernet Channels | 1 |
| Number of I2C Channels | 3 |
| Number of I/Os | 64 |
| Number of Timers/Counters | 16 |
| Operating Supply Voltage | 1.4 V |
| Oscillator Type | External |
| Peripherals | DMA, I2C, WDT |
| RAM Size | 32 kB |
| Schedule B | 8542310000 |
| Height | 1.95 mm |
| Length | 23 mm |
| Width | 23 mm |
Documentation for NXP Semiconductors NXP Semiconductors MPC5125YVN400
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