H9R25ST29C – MCP (Multi-Chip Package) Memory – SK Hynix

The H9R25ST29C is an SK Hynix H9-series MCP (Multi-Chip Package) memory device, a configuration that integrates mobile DRAM and NAND Flash in a single FBGA package. A hard-to-find part available now for RFQ at Pacific Component Xchange.

The H9R25ST29C is a memory component attributed to SK Hynix based on the company’s “H9” memory product prefix. SK Hynix uses the H9 prefix for its Multi-Chip Package (MCP) combination-memory products, which integrate mobile DRAM (LPDDR-class) and NAND Flash memory into a single space-saving FBGA package, a configuration widely used in smartphones, tablets, and other compact embedded systems where board area and power efficiency are critical.

Although the H9R25ST29C is occasionally cross-listed in broker catalogs with an incorrect manufacturer (such as Tyco / TE Connectivity), the “H9” naming convention is used exclusively by SK Hynix memory. TE Connectivity manufactures connectors, relays, and sensors rather than memory ICs, so the SK Hynix attribution reflects the true silicon origin.

Key Features

• Manufacturer: SK Hynix (current canonical brand)
• Family: H9-series MCP (Multi-Chip Package) combination memory
• Architecture: Mobile DRAM combined with NAND Flash in a single multi-chip package
• Package: Fine-pitch Ball Grid Array (FBGA) multi-chip package
• Typical use: Space- and power-constrained mobile and embedded designs

Note: SK Hynix does not publish a freely available public datasheet for this specific device code, and this exact part number could not be located on the manufacturer’s site, authorized distributors, or datasheet databases. Detailed density, organization, speed grade, and supply-voltage figures could not be independently verified from an authoritative source and are intentionally omitted to avoid publishing unconfirmed specifications. Our sourcing team can confirm exact die configuration, date codes, and packaging upon request.

Applications

• Smartphones and feature phones
• Tablets and portable consumer electronics
• Embedded and IoT modules requiring combined DRAM + NAND
• Industrial handheld and point-of-sale terminals
• Legacy mobile platform repair, maintenance, and end-of-life production

Why Source H9R25ST29C from Pacific Component Xchange

The H9R25ST29C is a hard-to-find SK Hynix MCP device with little to no authorized-distributor availability, making it difficult to procure through conventional supply channels. As an independent distributor specializing in obsolete, end-of-life, and allocation-constrained memory, Pacific Component Xchange can source this part to support your build.

Every order is backed by our commitment to authenticity and quality assurance, with inspection and verification processes designed to protect your build against counterfeit and substandard parts. We support global shipping and flexible quantities for both production and maintenance requirements.

Because this is a scarce part, it is offered on a Request-for-Quote (RFQ) basis. Submit an RFQ today for current pricing, lead time, and date-code availability, and our sourcing specialists will respond promptly.