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IS25WX256-LHLA3 – Serial NOR Flash (xSPI / Octal) – ISSI

The ISSI IS25WX256-LHLA3 is a 256Mbit (32M x 8) 1.8V xSPI Octal Serial NOR Flash with on-chip ECC, in a 24-ball TFBGA package, qualified to automotive temperature (-40C to +125C). Available now for RFQ.

Brand:ISSI
SKU: IS25WX256-LHLA3 Categories: ,
Please contact us or add to quote for current pricing and availability.

The IS25WX256-LHLA3 from Integrated Silicon Solution Inc. (ISSI) is a high-performance 256 Megabit (32M x 8) Serial NOR Flash memory built on ISSI’s xSPI Octal Flash architecture. It implements the JEDEC Standard xSPI (eXpanded Serial Peripheral Interface) with integrated on-chip ECC, delivering fast, reliable code and data storage in a compact, low-pin-count package ideal for space-constrained embedded designs.

This specific orderable variant decodes as follows: IS25WX = 1.70V to 2.0V flash with OPI (Octal Peripheral Interface) and on-chip ECC; 256 = 256Mbit density; option L = Optional Read While Write (RWW); package H = 24-ball TFBGA (6x8mm, 5×5 ball array); L = Halogen-free / RoHS & TSCA compliant; and A3 = Automotive Grade (-40C to +125C), meeting AEC-Q100 requirements.

Key Features

  • Density: 256 Mbit, organized as 32M x 8
  • Interface: JEDEC xSPI (eXpanded SPI) – Octal DDR (8D-8D-8D) and Extended SPI protocols
  • On-chip ECC: 2-bit detection and 1-bit correction per 16-byte boundary
  • Supply voltage: 1.70V to 2.0V (the WX series)
  • Maximum clock frequency: 166 MHz SDR / 200 MHz DDR
  • Memory organization: uniform 128KB sectors, 4KB / 32KB subsectors, 256-byte pages (optional 64KB sectors)
  • Erase granularity: 128KB Sector Erase plus 4KB / 32KB Subsector Erase
  • 4-Bank architecture enabling optional Read While Write (RWW) operation
  • Dedicated 64-byte OTP area that can be permanently locked
  • Endurance: more than 100,000 erase/program cycles
  • Data retention: more than 20 years
  • Package: 24-ball TFBGA, 6x8mm, 5×5 ball array
  • Temperature range: -40C to +125C (Automotive Grade, AEC-Q100)
  • Compliance: Halogen-free, RoHS & TSCA compliant

Applications

  • Automotive electronics, ADAS, infotainment and instrument clusters
  • Industrial controllers and IoT edge devices
  • Execute-in-place (XIP) firmware and boot code storage
  • 5G, networking and communications equipment
  • Embedded systems requiring low pin count and high throughput

Why Source IS25WX256-LHLA3 from Pacific Component Xchange

Pacific Component Xchange is an independent distributor specializing in hard-to-find and obsolete memory. The IS25WX256-LHLA3 is a specialized automotive-grade xSPI flash with limited authorized-channel availability, and our team helps engineering and procurement teams secure it when standard channels fall short.

Every order is backed by our authenticity and quality assurance programs, inspection and traceability processes, and global shipping. Because this is a Request-For-Quote part, pricing is provided on request and tailored to your quantity and delivery requirements. Submit an RFQ today to lock in availability and lead time for the IS25WX256-LHLA3.

Additional Information

Manufacturer

Integrated Silicon Solution Inc. (ISSI)

Component Type

Serial NOR Flash (xSPI / Octal, on-chip ECC)

Density

256 Mbit

Organization

32M x 8

Interface

JEDEC xSPI – Octal DDR (8D-8D-8D) & Extended SPI

Package

TFBGA-24 (6x8mm, 5×5 ball array)

Speed/Grade

166 MHz SDR / 200 MHz DDR

Supply Voltage

1.70V to 2.0V

Temp Range

-40C to +125C (Automotive Grade, AEC-Q100)

Endurance

>100,000 program/erase cycles; >20-year data retention

Part Status

Active

Availability

Available