What is the Samsung K4B2G1646F-BFMA?

It is a Samsung 2 Gb DDR3 SDRAM device (F-die) organized as 128M x 16 in a 96-ball FBGA package. It supports speeds up to DDR3-1866 (1866 Mbps) and operates at 1.35V (DDR3L) and 1.5V (DDR3).

Is the K4B2G1646F-BFMA automotive or industrial grade?

Yes. The BFMA variant is qualified for the extended -40u00b0C to +95u00b0C temperature range, making it suitable for automotive, industrial, and ruggedized applications.

What is the density and organization?

The device is 2 Gb with a 128M x 16 (x16) organization. As a DDR3 SDRAM it uses 8 internal banks and an 8n-bit prefetch architecture.

What supply voltage does it use?

It supports both 1.35V (DDR3L low-voltage) and 1.5V (standard DDR3) operation.

Is the K4B2G1646F-BFMA still in production?

No. Samsung has discontinued its DDR3 product line, so this part is end-of-life (EOL/obsolete). Pacific Component Xchange stocks it for designs that still require DDR3.

How do I buy the K4B2G1646F-BFMA?

This is a Request-for-Quote item. Submit an RFQ to Pacific Component Xchange for current pricing, lead time, date codes, and volume availability.

K4B2G1646F-BFMA – DDR3 SDRAM – Samsung

Samsung K4B2G1646F-BFMA is a 2 Gb DDR3 SDRAM (F-die) organized as 128M x 16 in a 96-ball FBGA package, rated up to DDR3-1866 (1866 Mbps) with 1.35V/1.5V operation and an automotive-grade -40°C to +95°C temperature range.

Brand:Samsung

SKU: K4B2G1646F-BFMA Categories: Electronic Parts, RFQ

Please contact us or add to quote for current pricing and availability.

The Samsung K4B2G1646F-BFMA is a 2 Gb DDR3 SDRAM device built on Samsung’s F-die process and organized as 128M x 16 (x16). Housed in a 96-ball FBGA package, it supports data rates up to DDR3-1866 (1866 Mbps) and operates at both 1.35V (DDR3L) and 1.5V (DDR3) supply voltages. The BFMA variant is an automotive / industrial-grade component qualified for the extended -40°C to +95°C operating temperature range, making it well suited to harsh-environment designs.

Key Features

Memory type: DDR3 SDRAM (Samsung F-die)
Density: 2 Gb
Organization: 128M x 16 (x16)
Speed grade: up to DDR3-1866 (1866 Mbps)
Supply voltage: 1.35V (DDR3L) and 1.5V (DDR3)
Package: 96-ball FBGA, lead-free / RoHS compliant
Architecture: 8 internal banks, 8n-bit prefetch (DDR3)
Operating temperature: -40°C to +95°C (automotive / industrial grade)

Applications

Automotive infotainment and instrument cluster systems
Advanced driver-assistance (ADAS) and telematics modules
Industrial control and embedded computing
Networking and communications equipment
Medical and ruggedized electronics requiring wide-temperature memory

Why Source K4B2G1646F-BFMA from Pacific Component Xchange

Samsung has discontinued its DDR3 product line, and the automotive-grade K4B2G1646F-BFMA can be difficult to find through authorized channels. Pacific Component Xchange is an independent distributor specializing in hard-to-find, obsolete, and long-lead-time memory. We help engineers and procurement teams keep legacy and automotive designs in production with thoroughly inspected, authenticity-verified inventory and worldwide shipping.

This part is offered on a Request-for-Quote basis. Submit an RFQ today for current pricing, lead time, date codes, and volume availability, and our sourcing team will respond promptly.

Additional Information

Manufacturer	Samsung
Component Type	DDR3 SDRAM (F-die)
Density	2 Gb
Organization	128M x 16 (x16)
Package	96-ball FBGA
Speed/Grade	Up to DDR3-1866 (1866 Mbps)
Supply Voltage	1.35V (DDR3L) / 1.5V (DDR3)
Temp Range	-40°C to +95°C (Automotive/Industrial)
Architecture	8 banks, 8n-bit prefetch
Part Status	Obsolete / EOL (Samsung DDR3 discontinued)
Availability	Available