
K4B2G1646F-BCNB – DDR3 SDRAM – Samsung
The Samsung K4B2G1646F-BCNB is a 2 Gb DDR3 SDRAM (F-die) organized as 128M x16, rated DDR3-1600 (CL11) at 1.5 V in a 96-ball FBGA package. A hard-to-find / obsolete memory IC available for RFQ.
The Samsung K4B2G1646F-BCNB is a 2 Gigabit DDR3 SDRAM device from Samsung’s F-die family. It is internally organized as 128M x16 (16-bit wide data) and operates at a 1.5 V supply, supporting a maximum data rate of DDR3-1600 (1600 Mbps/pin) with a CAS latency of CL11 (11-11-11). The device is supplied in a JEDEC-standard 96-ball FBGA package, making it a drop-in x16 component for embedded designs, networking gear, and legacy computing platforms that rely on DDR3 memory.
Key Features
- Memory type: DDR3 SDRAM (Samsung F-die)
- Density: 2 Gb
- Organization: 128M x16 (x16 data width)
- Speed grade: DDR3-1600, up to 1600 Mbps/pin (800 MHz fCK)
- CAS latency: CL11 (11-11-11) at DDR3-1600
- Supply voltage: VDD/VDDQ = 1.5 V ±0.075 V (JEDEC standard)
- Package: 96-ball FBGA
- 8 internal banks; 8n-bit prefetch architecture
Applications
- Networking and telecom line cards, routers and switches
- Industrial and embedded controllers
- Set-top boxes, digital signage and consumer electronics
- Legacy PC, notebook and workstation memory subsystems
- Test, measurement and medical equipment using DDR3
Why Source K4B2G1646F-BCNB from Pacific Component Xchange
The K4B2G1646F-BCNB is an end-of-life / obsolete DDR3 device with little to no authorized-distributor availability, which makes long-term production builds and field repairs challenging. Pacific Component Xchange specializes in hard-to-find and obsolete memory, helping engineers and procurement teams keep mature designs in production without costly redesigns. We support global shipping, rigorous authenticity and counterfeit-avoidance practices, and responsive sourcing for both prototype and volume quantities.
This part is offered on a Request-for-Quote (RFQ) basis. Contact Pacific Component Xchange for current pricing, lead time and quantity on K4B2G1646F-BCNB and let our team help secure the memory your build depends on.
Additional Information
| Manufacturer | Samsung |
|---|---|
| Component Type | DDR3 SDRAM |
| Density | 2 Gb |
| Organization | 128M x16 |
| Package | 96-ball FBGA |
| Speed/Grade | DDR3-1600 (1600 Mbps), CL11 (11-11-11) |
| Supply Voltage | 1.5 V ±0.075 V (VDD/VDDQ) |
| Die Revision | F-die |
| Part Status | Obsolete |
| Availability | Available |


