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HXI15H4G160AF-13K – DDR3 SDRAM – UniIC

The HXI15H4G160AF-13K is a 4 Gbit DDR3 SDRAM from UniIC (Xi’an UniIC Semiconductors), organized as 256M x16, rated DDR3-1600 (1.5 V) in a 96-ball TFBGA package. Available now for RFQ from Pacific Component Xchange.

Brand:UniIC
SKU: HXI15H4G160AF-13K Categories: ,
Please contact us or add to quote for current pricing and availability.

The HXI15H4G160AF-13K is a 4 Gigabit DDR3 SDRAM memory component manufactured by UniIC (Xi’an UniIC Semiconductors). It is configured as a 256M x16 device (16-bit wide data interface), operates at a standard 1.5 V supply, and is sorted to the DDR3-1600 (11-11-11) speed grade. The device is supplied in a 96-ball fine-pitch BGA (PG-TFBGA-96) package suitable for high-density embedded and industrial designs.

Within the UniIC nomenclature, the part decodes as follows: HXI = UniIC component prefix, 15 = 1.5 V VDD/VDDQ DDR3 (typical 1.5 V), H = DDR3 technology, 4G = 4 Gbit density, 16 = x16 I/O width, 0 = product variant, A = first die revision, F = lead-free FBGA package, and -13K = DDR3-1600K speed grade (CL-tRCD-tRP = 11-11-11). UniIC’s matching 1.35 V DDR3L devices use a “13” code in place of the “15” field.

Key Features

  • Memory type: DDR3 SDRAM (Double Data Rate Three)
  • Density: 4 Gbit
  • Organization: 256M x16 (x16 data I/O)
  • Speed grade: DDR3-1600 (1600 Mbps data rate), CL-tRCD-tRP = 11-11-11
  • Supply voltage: VDD / VDDQ = 1.5 V ± 0.075 V
  • Package: PG-TFBGA-96 (96-ball thin fine-pitch BGA), lead-free / RoHS compliant
  • Burst length: BL8 (fixed) and BC4 (via MRS or selectable on-the-fly)
  • On-die termination (ODT): nominal and dynamic ODT supported
  • Banks: 8 internal banks; 8n-bit prefetch architecture
  • Operating temperature: commercial range, case temperature TC of 0 °C to +95 °C

Applications

  • Networking and telecom line cards, routers and switches
  • Industrial control, automation and embedded computing
  • Set-top boxes, digital media and consumer electronics
  • Single-board computers and SoC/processor reference designs
  • Solid-state storage controllers and buffer memory

Why Source HXI15H4G160AF-13K from Pacific Component Xchange

UniIC DDR3 components such as the HXI15H4G160AF-13K have limited authorized-distributor availability, which makes secure, traceable sourcing essential for production and end-of-life builds. Pacific Component Xchange is an independent distributor specializing in hard-to-find and obsolete memory. We help engineering and procurement teams locate scarce DDR3, DDR3L and other SDRAM devices with rigorous authenticity and counterfeit-avoidance inspection, supporting documentation, and global shipping.

This part is offered on a Request-For-Quote basis. Contact Pacific Component Xchange for current pricing, lead time and quantity availability on HXI15H4G160AF-13K, or submit an RFQ for a fast, competitive quote.

Additional Information

Manufacturer

Xi'an UniIC Semiconductors (UniIC)

Component Type

DDR3 SDRAM

Density

4 Gbit

Organization

256M x16 (x16 data I/O)

Package

PG-TFBGA-96 (96-ball thin fine-pitch BGA)

Speed/Grade

DDR3-1600 (1600 Mbps), CL-tRCD-tRP = 11-11-11

Supply Voltage

1.5 V +/- 0.075 V (VDD/VDDQ)

Temp Range

Commercial, case temperature TC 0 C to +95 C

Part Status

Active

Availability

Available