
HXI15H4G160AF-13K – DDR3 SDRAM – UniIC
The HXI15H4G160AF-13K is a 4 Gbit DDR3 SDRAM from UniIC (Xi’an UniIC Semiconductors), organized as 256M x16, rated DDR3-1600 (1.5 V) in a 96-ball TFBGA package. Available now for RFQ from Pacific Component Xchange.
The HXI15H4G160AF-13K is a 4 Gigabit DDR3 SDRAM memory component manufactured by UniIC (Xi’an UniIC Semiconductors). It is configured as a 256M x16 device (16-bit wide data interface), operates at a standard 1.5 V supply, and is sorted to the DDR3-1600 (11-11-11) speed grade. The device is supplied in a 96-ball fine-pitch BGA (PG-TFBGA-96) package suitable for high-density embedded and industrial designs.
Within the UniIC nomenclature, the part decodes as follows: HXI = UniIC component prefix, 15 = 1.5 V VDD/VDDQ DDR3 (typical 1.5 V), H = DDR3 technology, 4G = 4 Gbit density, 16 = x16 I/O width, 0 = product variant, A = first die revision, F = lead-free FBGA package, and -13K = DDR3-1600K speed grade (CL-tRCD-tRP = 11-11-11). UniIC’s matching 1.35 V DDR3L devices use a “13” code in place of the “15” field.
Key Features
- Memory type: DDR3 SDRAM (Double Data Rate Three)
- Density: 4 Gbit
- Organization: 256M x16 (x16 data I/O)
- Speed grade: DDR3-1600 (1600 Mbps data rate), CL-tRCD-tRP = 11-11-11
- Supply voltage: VDD / VDDQ = 1.5 V ± 0.075 V
- Package: PG-TFBGA-96 (96-ball thin fine-pitch BGA), lead-free / RoHS compliant
- Burst length: BL8 (fixed) and BC4 (via MRS or selectable on-the-fly)
- On-die termination (ODT): nominal and dynamic ODT supported
- Banks: 8 internal banks; 8n-bit prefetch architecture
- Operating temperature: commercial range, case temperature TC of 0 °C to +95 °C
Applications
- Networking and telecom line cards, routers and switches
- Industrial control, automation and embedded computing
- Set-top boxes, digital media and consumer electronics
- Single-board computers and SoC/processor reference designs
- Solid-state storage controllers and buffer memory
Why Source HXI15H4G160AF-13K from Pacific Component Xchange
UniIC DDR3 components such as the HXI15H4G160AF-13K have limited authorized-distributor availability, which makes secure, traceable sourcing essential for production and end-of-life builds. Pacific Component Xchange is an independent distributor specializing in hard-to-find and obsolete memory. We help engineering and procurement teams locate scarce DDR3, DDR3L and other SDRAM devices with rigorous authenticity and counterfeit-avoidance inspection, supporting documentation, and global shipping.
This part is offered on a Request-For-Quote basis. Contact Pacific Component Xchange for current pricing, lead time and quantity availability on HXI15H4G160AF-13K, or submit an RFQ for a fast, competitive quote.
Additional Information
| Manufacturer | Xi'an UniIC Semiconductors (UniIC) |
|---|---|
| Component Type | DDR3 SDRAM |
| Density | 4 Gbit |
| Organization | 256M x16 (x16 data I/O) |
| Package | PG-TFBGA-96 (96-ball thin fine-pitch BGA) |
| Speed/Grade | DDR3-1600 (1600 Mbps), CL-tRCD-tRP = 11-11-11 |
| Supply Voltage | 1.5 V +/- 0.075 V (VDD/VDDQ) |
| Temp Range | Commercial, case temperature TC 0 C to +95 C |
| Part Status | Active |
| Availability | Available |


