HXB13H4G160AF-13KT – DDR3L SDRAM – UniIC

The HXB13H4G160AF-13KT is a Xi’an UniIC 4Gb DDR3L SDRAM organized as 256M x16, rated for DDR3L-1600 (11-11-11) operation at 1.35V in a 96-ball TFBGA package. Available for RFQ from Pacific Component Xchange.

The HXB13H4G160AF-13KT is a 4-gigabit DDR3L Synchronous DRAM from Xi’an UniIC Semiconductors, configured as a 256M x16 device. It is rated for DDR3L-1600 operation (CL-tRCD-tRP = 11-11-11) and supplied in a Pb-free 96-ball TFBGA package (13.5 mm x 7.5 mm). The “13” field denotes a DDR3L core operating at a typical VDD/VDDQ of 1.35V, while remaining backward compatible with 1.5V DDR3 applications, making it a flexible drop-in for both low-power and standard-voltage designs.

This part belongs to UniIC’s 4Gbit DDR3L component generation, which shares the same die and electrical specification as the documented SCB13H4G160AF-13K ordering family. The x16 organization concentrates 4Gb of density into a single 96-ball package, simplifying board routing for space-constrained and bandwidth-sensitive systems.

Key Features

• Density: 4 Gbit
• Organization: 256M x16
• Memory type: DDR3L SDRAM (DDR3 technology, low-voltage)
• Speed grade: DDR3L-1600, CL-tRCD-tRP = 11-11-11 (800 MHz clock / 1600 Mbps)
• Supply voltage: VDD/VDDQ = 1.35V typical (1.283V-1.45V); backward compatible to 1.5V +/- 0.075V
• Package: 96-ball TFBGA (PG-TFBGA-96), 13.5 mm x 7.5 mm, Pb-free
• Architecture: 8 internal banks, 8n-bit prefetch, BL8 / BC4 on-the-fly
• On-die termination (ODT), programmable CAS latencies, and output driver calibration
• Operating temperature: Commercial, 0 C to +95 C (TC)

Applications

• Networking and telecom line cards
• Industrial control and embedded computing
• Set-top boxes, digital signage, and consumer multimedia
• SSD and storage controller buffers
• Routers, switches, and gateway equipment
• Single-board computers and IoT gateways

Why Source HXB13H4G160AF-13KT from Pacific Component Xchange

UniIC memory components such as the HXB13H4G160AF-13KT have little to no authorized-distributor presence in Western markets, making them difficult to procure through traditional channels. As an independent distributor specializing in hard-to-find and obsolete memory, Pacific Component Xchange can support both prototype and production volumes.

Every order is backed by our authenticity and quality assurance program, with inspection and traceability to reduce counterfeit risk. We offer worldwide shipping and responsive support for end-of-life, allocation-constrained, and scarce DRAM requirements.

Request a quote (RFQ) today for current pricing, lead time, and volume availability on the HXB13H4G160AF-13KT.