What is the SK Hynix H5CGD8MGBDX021N?

It is a DDR5 SDRAM memory component from SK Hynix with a density of 24Gb (3 GB) and an x8 organization, built on SK Hynix's 1a-nm (D1a) EUV DRAM process.

What is the density and organization of the H5CGD8MGBDX021N?

The device is a 24Gb (3 GB) DDR5 DRAM die organized as x8. The '24Gb x8' configuration is confirmed by SK Hynix's product family and by third-party die analysis (TechInsights floorplan report on the H5CGD8M family).

Is the H5CGD8MGBDX021N still in production?

Yes. It is part of SK Hynix's current-generation DDR5 DRAM lineup and is considered active. Despite active status, supply through authorized channels is constrained, which is why it is offered on an RFQ basis.

What applications use this DDR5 SDRAM?

24Gb x8 DDR5 DRAM is used in server and data center modules, desktop and notebook memory, high-performance computing, workstations, and AI/ML platforms requiring high-density memory.

How do I get pricing for the H5CGD8MGBDX021N?

This is a request-for-quote (RFQ) product. Contact Pacific Component Xchange with your quantity and target requirements, and our team will provide a quote along with current availability.

Is Pacific Component Xchange an authorized distributor?

Pacific Component Xchange is an independent distributor specializing in hard-to-find, allocated, and obsolete memory. We source components like the H5CGD8MGBDX021N that have little or no authorized-distributor availability, backed by quality inspection and counterfeit-avoidance processes.

H5CGD8MGBDX021N – DDR5 SDRAM – SK Hynix

The SK Hynix H5CGD8MGBDX021N is a 24Gb (x8) DDR5 SDRAM component built on SK Hynix’s 1a-nm (D1a) EUV DRAM process. Available now for RFQ at Pacific Component Xchange.

Brand:SK Hynix

SKU: H5CGD8MGBDX021N Categories: Electronic Parts, RFQ

Please contact us or add to quote for current pricing and availability.

The SK Hynix H5CGD8MGBDX021N is a high-density DDR5 SDRAM memory component organized as 24Gb x8. Manufactured on SK Hynix’s advanced 1a-nm (D1a) EUV DRAM process, this monolithic DDR5 die delivers the bandwidth and capacity density required by next-generation server, client, and high-performance computing platforms. The 3 GB-per-die (24Gb) organization enables higher-capacity DIMM and module builds using fewer components, making it a sought-after building block for modern memory subsystems.

Key Features

Memory type: DDR5 SDRAM (Synchronous Dynamic Random Access Memory)
Density: 24 Gigabit (3 GB) per device
Organization: x8 data width
Die generation: SK Hynix 1a-nm D1a, EUV lithography
Package: FBGA (fine-pitch ball grid array)
Manufacturer: SK Hynix

Applications

Server and data center memory (RDIMM / module assemblies)
Desktop and notebook system memory (UDIMM / SODIMM)
High-performance computing and workstation platforms
AI / ML acceleration and in-memory workloads
Networking and embedded systems requiring high-density DRAM

Why Source H5CGD8MGBDX021N from Pacific Component Xchange

Cutting-edge DDR5 DRAM components like the H5CGD8MGBDX021N can be difficult to secure through authorized channels due to constrained allocation and high demand. As an independent distributor specializing in hard-to-find, allocated, and obsolete memory, Pacific Component Xchange bridges the gap. We currently have inventory available for this part.

Every order is backed by our commitment to authenticity and quality, with rigorous inspection and counterfeit-avoidance processes to protect your build. We ship globally and support both prototype and volume requirements. Because this is an allocated, high-demand component, pricing is provided on a request-for-quote basis. Contact Pacific Component Xchange today to request a quote (RFQ) for the H5CGD8MGBDX021N and lock in availability.

Additional Information

Manufacturer	SK Hynix
Component Type	DDR5 SDRAM
Density	24 Gb (3 GB)
Organization	x8
Die Generation	1a-nm D1a (EUV)
Package	FBGA
Part Status	Active
Availability	Available