SDINBDI4-256G – eMMC 5.1 NAND Flash – SanDisk

The SanDisk SDINBDI4-256G is a 256GB iNAND 7550 family e.MMC 5.1 embedded flash device in a 153-ball TFBGA (11.5 x 13 x 1.0 mm) package, built on SanDisk 3D 64-layer X3 (TLC) NAND with HS400 and Command-Queue support. Available for RFQ at Pacific Component Xchange.

The SanDisk SDINBDI4-256G is a 256GB managed-NAND embedded flash device from the SanDisk (Western Digital) iNAND 7550 family. It integrates a flash memory controller, embedded flash-management firmware, and SanDisk 3D 64-layer X3 (Triple-Level-Cell / TLC) NAND in a single JEDEC-compliant 153-ball TFBGA package measuring 11.5 x 13 x 1.0 mm. The device presents a standard e.MMC 5.1 interface to the host, abstracting NAND management (wear leveling, ECC, bad-block handling) so designers can integrate high-density storage with minimal qualification effort.

Compliant with the JEDEC e.MMC 5.1 specification, the iNAND 7550 platform supports the HS400 high-speed DDR mode along with Command-Queue, Field Firmware Upgrade (FFU), boot and RPMB partitions, Cache, Packed Commands, Power-Off Notification, Sanitize, Secure Erase/Trim, HW Reset, and Host-Device Synchronization (Enhanced Strobe). SanDisk’s SmartSLC architecture is used to accelerate write bursts and improve endurance.

Note on part numbering: The canonical SanDisk iNAND 7550 256GB ordering part number per the manufacturer datasheet is SDINBDA4-256G. Buyers should confirm the exact marking and ordering code when requesting a quote.

Key Features

• Density: 256GB managed NAND
• Memory technology: SanDisk 3D 64-layer X3 (TLC) NAND with embedded controller and firmware
• Interface: JEDEC e.MMC 5.1 (HS400) with Command-Queue support
• Clock frequencies: up to 200 MHz SDR (HS200) and 200 MHz DDR (HS400); up to 400 MB/s bus transfer rate (8-bit, HS400)
• Package: 153-ball TFBGA, 11.5 x 13 x 1.0 mm, JEDEC form factor
• Dual power supply: Core (VCC) 2.7-3.6V; I/O (VCCQ) 1.7-1.95V or 2.7-3.6V (3.3V VCCQ operation limited to max 1 hour per datasheet; HS200/HS400 support only the 1.7-1.95V VCCQ option)
• Operating temperature: -25°C to +85°C (Tcase)
• Moisture sensitivity level: MSL 3
• Advanced e.MMC 5.1 features: FFU, Cache, Boot/RPMB partitions, Sanitize, Secure Erase/Trim, HW Reset, Enhanced Strobe, Device Health/EOL status

Applications

• Industrial and embedded computing systems
• Automotive infotainment and telematics
• IoT gateways and edge devices
• Networking and communications equipment
• Multimedia handsets, tablets, and portable devices
• Single-board computers and embedded controllers

Why Source SDINBDI4-256G from Pacific Component Xchange

The SDINBDI4-256G is a high-density embedded flash device with limited authorized-distributor availability, making it difficult to source through standard channels. Pacific Component Xchange is an independent distributor specializing in hard-to-find, end-of-life, and obsolete memory and embedded flash. We can help locate and quote this part and its iNAND 7550 equivalents.

Every order is backed by our commitment to authenticity and quality, with inspection and counterfeit-avoidance processes to protect your supply chain. We support global shipping and can help secure long-lead or discontinued e.MMC devices for production builds, last-time buys, and EOL replacements.

Request a quote (RFQ) today for SDINBDI4-256G and our team will respond with current pricing, available quantity, and lead time.