Toll Free 800-993-9047 | International 714-374-3070
Select Page

K4FBE3D4HM-TFCL – LPDDR4 SDRAM – Samsung

The Samsung K4FBE3D4HM-TFCL is a 32Gb DDP (dual-die package) automotive-grade LPDDR4 SDRAM in a 200-ball FBGA, rated for -40°C to +95°C operation. Now obsolete and hard to source – available for RFQ at Pacific Component Xchange.

Brand:Samsung
SKU: K4FBE3D4HM-TFCL Categories: ,
Please contact us or add to quote for current pricing and availability.

The Samsung K4FBE3D4HM-TFCL is a 32-gigabit (4GB) DDP LPDDR4 SDRAM designed for automotive and embedded applications that demand high bandwidth at low power. Built as a dual-die package (DDP) device, it provides an x16 organization per channel across two independent channels, with 8 banks per channel, packaged in a compact 200-ball FBGA measuring 10 x 15 mm. The “-TFCL” variant carries the automotive temperature grade of -40°C to +95°C, making it suitable for in-cabin and infotainment platforms where extended thermal range is required.

Key Features

  • Density: 32Gb (4GB), DDP (dual-die package)
  • Memory type: Low-Power DDR4 (LPDDR4) SDRAM, automotive grade
  • Organization: x16 per channel, 2 channels, 8 banks per channel (64M x32DQ x8banks x2channels)
  • Speed bin: 3200 / 3733 / 4266 Mbps data rate
  • Burst length: 16, 32 (on-the-fly)
  • I/O interface: LVSTL_11; differential clock (CLK/CLKB) and differential DQS (DQS/DQSB), single-ended bi-directional data
  • Supply voltages: VDD1 1.70-1.95V, VDD2 1.06-1.17V, VDDQ 1.06-1.17V
  • Operating temperature: -40°C to +95°C (automotive)
  • Package: 200-ball FBGA, 10 x 15 mm
  • Functions: Auto / Self Refresh, Masked Write, Data Mask (DBI), ZQ calibration, Write Leveling, PASR, TCSR, configurable drive strength

Applications

  • Automotive infotainment and in-vehicle entertainment (IVI) systems
  • Advanced driver-assistance systems (ADAS) compute modules
  • Digital instrument clusters and telematics units
  • Embedded SoC and application-processor platforms
  • Industrial gateways and edge-compute devices requiring extended temperature memory

Why Source K4FBE3D4HM-TFCL from Pacific Component Xchange

The K4FBE3D4HM-TFCL is an end-of-life automotive LPDDR4 device that is increasingly difficult to secure through authorized distribution, making it a challenging part for legacy automotive and embedded builds. Pacific Component Xchange is an independent distributor specializing in hard-to-find, obsolete, and allocated memory. We support legacy programs that still depend on this device.

Every order is backed by our commitment to authenticity and quality control, with inspection and testing options available to protect your supply chain against counterfeit risk. We ship globally and can support both prototype and production volumes.

This is a Request-For-Quote (RFQ) item. Contact Pacific Component Xchange today to request a quote, confirm current stock and lead time, and lock in pricing for the Samsung K4FBE3D4HM-TFCL.

Additional Information

Manufacturer

Samsung

Component Type

LPDDR4 SDRAM (Automotive, DDP)

Density

32Gb (4GB)

Organization

x16 per channel, 2 channels, 8 banks/channel

Package

FBGA-200, 10 x 15 mm

Speed/Grade

3200 / 3733 / 4266 Mbps

Supply Voltage

VDD1 1.70-1.95V; VDD2/VDDQ 1.06-1.17V

Temp Range

-40 C to +95 C (Automotive)

Part Status

Obsolete / Discontinued

Availability

Available