
KLM8G1GEUF-B04P057 – eMMC 5.1 – Samsung
Samsung KLM8G1GEUF-B04P057 is an 8GB eMMC 5.1 managed NAND flash device built on Samsung MLC NAND in a 153-ball FBGA package, supporting the HS400 interface for embedded and industrial storage.
The Samsung KLM8G1GEUF-B04P057 is an 8GB embedded MultiMediaCard (e.MMC) compliant with the JEDEC eMMC 5.1 standard. It integrates Samsung 1znm-class MLC NAND flash together with a managed flash controller in a single 153-ball FBGA package, presenting a simple, standardized block-storage interface to the host. By handling NAND management functions such as wear leveling, bad-block management, and ECC internally, the device greatly simplifies non-volatile storage design for embedded, mobile, networking, and industrial platforms.
The KLM8G1GEUF-B04P057 supports the high-speed HS400 interface mode (200 MHz DDR) of eMMC 5.1 and uses a dual-voltage scheme typical of Samsung e.MMC devices, with separate supplies for the controller/interface and the NAND core. The device carries the “P” temperature grade, rated for an operating case temperature of -40 degC to +95 degC.
Key Features
- Capacity: 8GB managed NAND (e.MMC)
- Standard: JEDEC eMMC 5.1 compliant
- NAND type: Samsung MLC (Multi-Level Cell), 1znm-class process
- Package: 153-ball FBGA, 11.5 mm x 13 mm x 0.8 mm
- Interface: HS400 high-speed eMMC bus (200 MHz DDR)
- Controller / interface supply (VDD/VCCQ): 1.70 V – 1.95 V or 2.7 V – 3.6 V
- NAND core supply (VDDF/VCC): 2.7 V – 3.6 V
- Operating case temperature: -40 degC to +95 degC (“P” grade)
- Integrated flash management: wear leveling, bad-block management, and ECC
Applications
- Networking and telecom equipment (routers, switches, gateways)
- Industrial control and embedded computing systems
- Set-top boxes, digital signage, and consumer electronics
- IoT gateways and edge devices
- General-purpose embedded boot and data storage
Why Source KLM8G1GEUF-B04P057 from Pacific Component Xchange
Managed NAND devices like the KLM8G1GEUF-B04P057 frequently see constrained or end-of-allocation availability through authorized channels, making them difficult to source for long-lifecycle and production builds. Pacific Component Xchange is an independent distributor specializing in hard-to-find and obsolete memory, and we currently have inventory of this Samsung e.MMC available.
Our team supports authenticity verification and inspection, global shipping, and responsive quoting for both prototype and high-volume requirements. Because this is a Request-for-Quote (RFQ) part, pricing is provided on request based on quantity and lead time. Contact Pacific Component Xchange today to request a quote on KLM8G1GEUF-B04P057 and secure the inventory you need.
Additional Information
| Manufacturer | Samsung |
|---|---|
| Component Type | eMMC 5.1 (Managed NAND) |
| Density | 8GB |
| NAND Type | MLC (1znm-class) |
| Package | FBGA-153 (11.5 x 13 x 0.8 mm) |
| Interface / Speed Grade | HS400 (eMMC 5.1, 200 MHz DDR) |
| Controller/Interface Supply (VDD/VCCQ) | 1.70 V – 1.95 V or 2.7 V – 3.6 V |
| NAND Core Supply (VDDF/VCC) | 2.7 V – 3.6 V |
| Operating Temperature | -40 degC to +95 degC (case, P grade) |
| Part Status | Active |
| Availability | Available |

