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H27QEG8M2AW2-BCF – 256Gb 3D TLC NAND Flash – SK Hynix

The H27QEG8M2AW2-BCF is an SK Hynix 256Gb (32GB) x8 3D TLC NAND Flash memory device in a 152-ball FBGA package. This is a hard-to-find, request-for-quote part available now through Pacific Component Xchange.

Brand:SK Hynix
SKU: H27QEG8M2AW2-BCF Categories: ,
Please contact us or add to quote for current pricing and availability.

The H27QEG8M2AW2-BCF is a high-density raw 3D TLC (Triple-Level Cell) NAND Flash memory device manufactured by SK Hynix as part of its H27Q-series 3D NAND family. The device offers 256Gb (32GB) of storage with an industry-standard x8 (8-bit) I/O interface, packaged in a compact 152-ball FBGA. It is intended for designs that require bare, controller-managed NAND for high-capacity non-volatile storage.

As an SK Hynix 3D NAND component, the H27QEG8M2AW2-BCF stacks memory cells vertically to deliver greater bit density and improved reliability per unit area compared with planar (2D) NAND, making it well suited to embedded storage, SSD, and storage-controller applications that integrate their own ECC and wear-leveling.

Key Features

  • Memory type: 3D TLC NAND Flash (raw / parallel NAND)
  • Density: 256Gb (32GB)
  • Organization: x8 (8-bit data interface)
  • Cell technology: Triple-Level Cell (TLC), 3D NAND architecture
  • Package: 152-ball FBGA
  • Manufacturer: SK Hynix (H27Q series)

Applications

  • Solid-state drives (SSDs) and embedded SSD modules
  • Storage-controller-based mass-storage subsystems
  • Industrial and embedded computing platforms
  • Networking, telecom, and data-center storage boards
  • Consumer electronics requiring high-density non-volatile storage
  • Set-top boxes, media players, and IoT gateways

Why Source H27QEG8M2AW2-BCF from Pacific Component Xchange

Pacific Component Xchange is an independent distributor specializing in hard-to-find, allocated, and obsolete memory. The H27QEG8M2AW2-BCF has little to no authorized-distributor availability, making it a challenging part to source through conventional channels. We can support both prototype and high-volume production requirements for this SK Hynix 3D TLC NAND device.

Every device is subject to our authenticity and quality-assurance processes to protect your supply chain against counterfeit and substandard components. We offer competitive request-for-quote pricing, global shipping, and responsive support for engineers and buyers managing end-of-life and supply-constrained memory.

Request a quote (RFQ) today for H27QEG8M2AW2-BCF and let our sourcing team secure the quantity you need.

Additional Information

Manufacturer

SK Hynix

Component Type

3D TLC NAND Flash

Density

256Gb (32GB)

Organization

x8 (8-bit)

Cell Technology

Triple-Level Cell (TLC), 3D NAND

Package

152-ball FBGA

Part Status

NRND / Hard-to-Find

Availability

Available