Toll Free 800-993-9047 | International 714-374-3070
Select Page

H27QDG8T2CW2-BCF – MLC NAND Flash – SK Hynix

The H27QDG8T2CW2-BCF is an SK Hynix 128Gb (x8) 3D MLC NAND Flash memory device in a 152-ball FBGA package. This obsolete, hard-to-find part is available for RFQ from Pacific Component Xchange.

Brand:SK Hynix
SKU: H27QDG8T2CW2-BCF Categories: ,
Please contact us or add to quote for current pricing and availability.

The SK Hynix H27QDG8T2CW2-BCF is a 128-gigabit (Gb) 3D MLC NAND Flash memory device with an x8 data interface, supplied in a 152-ball FBGA package. It belongs to SK Hynix’s H27Q 3D NAND (V-NAND) family, with the base device (H27QDG8T2C) built on the 3D-V2 generation process and rated for a 3.3 V supply, making it a high-density NAND option for embedded storage and SSD platforms.

Key Features

  • Manufacturer: SK Hynix
  • Memory type: 3D MLC (multi-level cell) NAND Flash (3D-V2 generation)
  • Density: 128 Gbit
  • Organization: x8
  • Package: 152-ball FBGA
  • Supply voltage (VCC): 3.3 V
  • Interface: High-speed (Toggle 2.0) x8 NAND interface
  • Family: SK Hynix H27Q 3D NAND (V-NAND) series
  • Part status: Obsolete / hard-to-find

Note: The 128 Gb density, MLC cell type, 3D-V2 NAND construction, x8 organization, 3.3 V supply and 152-ball FBGA package are confirmed from the SK Hynix H27Q-family NAND product datasheet for the base device H27QDG8T2C. Detailed electrical timing, endurance and temperature-grade figures should be confirmed against the SK Hynix datasheet for the specific BCF revision before design-in.

Applications

  • Solid-state drives (SSD) and embedded storage modules
  • Set-top boxes, smart TVs and home networking equipment
  • Industrial and embedded computing platforms
  • Networking gear, routers and gateways
  • Consumer electronics requiring high-density NAND
  • Legacy product builds and end-of-life maintenance/repair

Why Source H27QDG8T2CW2-BCF from Pacific Component Xchange

The H27QDG8T2CW2-BCF is an obsolete, hard-to-find NAND Flash device with little to no authorized-distributor stock remaining. As an independent distributor specializing in hard-to-find and end-of-life memory, Pacific Component Xchange helps engineers and procurement teams secure these scarce parts when traditional channels have dried up. We support legacy production, last-time buys and field-service requirements with quantity availability on this line item.

Every order is backed by our commitment to authenticity and quality, with inspection and counterfeit-avoidance processes appropriate for legacy memory, plus global shipping to keep your builds on schedule. Pricing on this part is quote-based. Submit an RFQ to Pacific Component Xchange for current pricing, lead time and available quantity on the H27QDG8T2CW2-BCF.

Additional Information

Manufacturer

SK Hynix

Component Type

3D MLC NAND Flash (3D-V2)

Density

128 Gbit

Organization

x8

Package

FBGA-152 (152-ball)

Supply Voltage

VCC 3.3 V

Interface

High-speed (Toggle 2.0) x8 NAND

Family

SK Hynix H27Q 3D NAND (V-NAND) series

Temp Range

Not specified – confirm per datasheet revision

Part Status

Obsolete / Hard-to-find

Availability

Available