XC7Z035-2FBG676E – FPGA SoC – AMD Xilinx

The XC7Z035-2FBG676E is an AMD Xilinx Zynq-7000 FPGA SoC pairing a dual-core ARM Cortex-A9 processing system with 275,150 Kintex-7 class logic cells in a 676-ball FCBGA package. Available now for RFQ.

The XC7Z035-2FBG676E is an AMD Xilinx Zynq-7000 All Programmable SoC that combines a feature-rich dual-core ARM Cortex-A9 MPCore processing system (PS) with high-density, Kintex-7 class programmable logic (PL) on a single 28 nm device. This tight PS-PL integration lets designers run a full software stack on the Cortex-A9 cores while offloading latency-critical, parallel, and high-throughput tasks to the fabric, making the XC7Z035-2FBG676E a strong fit for embedded systems that demand both flexible compute and deterministic hardware acceleration.

With 275,150 logic cells, 900 DSP48E1 slices, and 17.6 Mb of block RAM, the XC7Z035-2FBG676E delivers ample signal-processing horsepower for vision, radio, and control workloads. The −2 speed grade supports a maximum processor frequency of 800 MHz, and the Extended (E) temperature grade (0°C to 100°C TJ) suits demanding industrial and instrumentation environments. The device ships in a 676-ball FCBGA package (27×27 mm, 1.0 mm pitch) for surface-mount assembly.

Key Features

• Zynq-7000 SoC architecture: ARM Cortex-A9 processing system plus Kintex-7 class programmable logic
• Dual-core ARM Cortex-A9 MPCore with CoreSight, up to 800 MHz at the −2 speed grade
• 275,150 programmable logic cells for custom hardware acceleration and interfacing
• 900 DSP48E1 slices for high-performance arithmetic and signal processing
• 17.6 Mb of total block RAM for on-chip buffering and data movement
• Built on a 28 nm process for a balance of performance and power efficiency
• Extended (E) temperature grade rated 0°C to 100°C junction temperature
• 676-ball FCBGA package, 27×27 mm with 1.0 mm ball pitch, surface-mount (SMD/SMT)

Applications

• Embedded vision and image processing
• Industrial motor control and automation
• Software-defined radio and wireless communications
• Automotive driver assistance (ADAS)
• Medical imaging and instrumentation
• Aerospace and defense signal processing
• High-performance embedded computing

Why Source XC7Z035-2FBG676E from Pacific Component Xchange

Pacific Component Xchange is a trusted source for the XC7Z035-2FBG676E and other AMD Xilinx Zynq-7000 devices, including active, allocated, hard-to-find, and obsolete parts. We carry inventory on this part and can support production volumes through our RFQ process — simply request a quote and our team will respond with current pricing, lead time, and availability. Every XC7Z035-2FBG676E we supply is backed by our commitment to quality and authenticity, with inspection and traceability to help protect your build against counterfeit risk. With global shipping and responsive sourcing support, Pacific Component Xchange helps engineering and procurement teams keep designs on schedule. Contact us today to request a quote on the XC7Z035-2FBG676E.