
W25N01GVZEIGS – SLC NAND Flash – Winbond
The Winbond W25N01GVZEIGS is a 1G-bit (128MB) 2.7V-3.6V serial SLC NAND flash memory with Standard/Dual/Quad SPI interface, on-chip 1-bit ECC and bad-block management, in an 8-pad WSON 8x6mm package, industrial temperature rated.
The Winbond W25N01GVZEIGS is a 1G-bit (1,073,741,824-bit / 128MB) Serial SLC NAND Flash memory from the W25N “SpiFlash” QspiNAND family. It delivers a high-density, space-saving code- and data-storage solution for embedded systems with limited pins, board space and power. The device combines a NAND flash array with a Standard, Dual and Quad Serial Peripheral Interface (SPI), on-chip 1-bit hardware ECC and built-in bad-block management, giving designers NOR-like ease of use with NAND-class density and cost.
The “ZEIGS” suffix decodes to an 8-pad WSON 8x6mm package (package code ZE), Industrial temperature grade -40 C to +85 C (I), and Green / lead-free, RoHS-compliant, halogen-free package (G). The trailing characters denote the factory packing/option for the base W25N01GVZEIG device.
Key Features
- 1G-bit (128MB) Serial SLC NAND Flash memory
- Memory organized as 65,536 programmable pages of 2,048 bytes (plus 64-byte spare per page, 2,112-byte total page), 64 pages per 128KB block, 1,024 erasable blocks
- Single 2.7V to 3.6V power supply
- Standard SPI plus Dual and Quad I/O SPI; clocks up to 104MHz (equivalent 208MHz Dual / 416MHz Quad on Fast Read Dual/Quad I/O)
- On-chip 1-bit ECC (1 bit per 528 bytes) on read and program operations, with ECC status bits
- Built-in bad-block management / BBM look-up table (LUT)
- 2KB Unique ID page, 2KB parameter page, and ten 2KB OTP pages
- Low power: as low as 25mA active and 10uA standby (typical)
- Industrial temperature range: -40 C to +85 C
- 8-pad WSON 8x6mm package; Green, lead-free, RoHS-compliant, halogen-free
Applications
- Embedded code and data storage in space-constrained designs
- IoT modules, wearables and connected devices
- Networking, set-top boxes and home gateways
- Industrial control and instrumentation
- Wi-Fi / Bluetooth / RF modules and firmware storage
- Consumer electronics and audio/video systems
Why Source W25N01GVZEIGS from Pacific Component Xchange
The W25N01GVZEIGS is reaching end-of-life status with limited authorized-distributor availability, making it a hard-to-find part for engineers maintaining existing designs and production lines. Pacific Component Xchange is an independent distributor specializing in hard-to-find, obsolete and NRND memory.
Every order is backed by our commitment to authenticity and quality, with inspection and traceability processes to help protect your supply chain against counterfeit risk. We support global shipping and flexible quantities for both prototype and production needs. Request a quote (RFQ) today to secure pricing and lead time on the W25N01GVZEIGS and let our sourcing team help keep your build on schedule.
Additional Information
| Manufacturer | Winbond Electronics |
|---|---|
| Component Type | Serial SLC NAND Flash (W25N SpiFlash / QspiNAND) |
| Density | 1 Gbit (128 MB) |
| Organization | 65,536 pages x 2,048 bytes (+64B spare, 2,112B total page); 64 pages/block; 1,024 blocks (128KB) |
| Package | 8-pad WSON 8x6mm (Package Code ZE) |
| Interface | Standard / Dual / Quad SPI |
| Speed/Grade | Up to 104MHz SPI clock |
| Supply Voltage | 2.7V to 3.6V |
| ECC | On-chip 1-bit ECC (1 bit / 528 bytes) |
| Temp Range | Industrial, -40 C to +85 C |
| Part Status | NRND / End-of-Life (Last Time Buy) |
| Availability | Available |


