
KLM8G1GEUF-B04P05 – eMMC 5.1 NAND Flash – Samsung
Samsung KLM8G1GEUF-B04P05 is an 8GB managed-NAND eMMC 5.1 device in a 153-ball FBGA package, integrating MLC NAND flash with an onboard controller for embedded storage. P-grade rated for -40°C to +95°C operation. Available now for RFQ from Pacific Component Xchange.
The Samsung KLM8G1GEUF-B04P05 is an 8GB embedded MultiMediaCard (eMMC) compliant with the JEDEC eMMC 5.1 standard. Part of Samsung’s KLM8G1GEUF-B04 family, this managed-NAND device integrates MLC NAND flash memory together with an embedded flash controller in a single 153-ball FBGA package, simplifying host design by handling error correction (ECC), wear leveling, and bad-block management internally.
The device supports the high-speed HS400 interface (200MHz DDR) and offers a dual-voltage interface rail, making it well suited to embedded, industrial, and automotive-class platforms that require reliable nonvolatile storage in a small footprint. The “P” grade in the part number denotes an extended case-temperature rating of -40°C to +95°C per the Samsung datasheet.
Key Features
- Capacity: 8GB managed NAND (eMMC)
- Interface: JEDEC eMMC 5.1 compliant
- High-speed HS400 mode (200MHz DDR); MMC clock 0–200MHz
- Data bus width: 1-bit, 4-bit, and 8-bit
- Package: 153-ball FBGA, 11.5 x 13 x 0.8 mm
- Interface power VDD (VCCQ): 1.70V–1.95V or 2.7V–3.6V (dual-voltage)
- Memory (flash) power VDDF (VCC): 2.7V–3.6V
- Operating case temperature (P grade): -40°C to +95°C
- Integrated MLC NAND flash plus embedded controller (ECC, wear leveling, bad-block management)
- Built-in secure write protection and hardware reset
Applications
- Automotive infotainment, telematics, and clusters (extended-temperature designs)
- Industrial embedded systems and single-board computers
- IoT and connected/edge devices
- Networking and communications equipment
- Consumer electronics and set-top boxes
Why Source KLM8G1GEUF-B04P05 from Pacific Component Xchange
The KLM8G1GEUF-B04P05 can be difficult to obtain through authorized channels, and managed-NAND devices like this are frequently subject to allocation, EOL transitions, and shifting lead times. Pacific Component Xchange specializes in sourcing hard-to-find and obsolete memory, giving design and procurement teams a reliable path to the parts they need.
We maintain stock and a global supplier network, apply rigorous authenticity and inspection processes to guard against counterfeit components, and ship worldwide. Request a quote (RFQ) today and our team will respond with current pricing, availability, and lead time for the KLM8G1GEUF-B04P05.
Additional Information
| Manufacturer | Samsung |
|---|---|
| Component Type | eMMC 5.1 Managed NAND Flash |
| Density | 8GB |
| Organization | Managed NAND (eMMC) with integrated controller |
| NAND Type | MLC |
| Package | FBGA-153 (11.5 x 13 x 0.8 mm) |
| Speed/Grade | eMMC 5.1, HS400 mode (200MHz DDR) |
| Supply Voltage | VCCQ (I/O) 1.70–1.95V or 2.7–3.6V; VCC (flash) 2.7–3.6V |
| Temp Range | -40°C to +95°C (case temp, P grade) |
| Part Status | Active |
| Availability | Available |


