
KLM8G1GEUF-B04P – eMMC 5.1 – Samsung
The Samsung KLM8G1GEUF-B04P is an 8GB automotive-grade eMMC 5.1 managed NAND device in a 153-ball FBGA package, supporting HS400 (200MHz DDR) and a -40C to +95C operating temperature range.
The Samsung KLM8G1GEUF-B04P is an 8GB automotive-grade eMMC 5.1 managed NAND device that integrates 64 Gb MLC NAND flash and a JEDEC-compliant eMMC controller into a single compact 153-ball FBGA package. Designed for the rigors of in-vehicle and industrial deployment, this part offers a wide -40 C to +95 C operating temperature window, making it well suited for infotainment, telematics, instrument clusters, and other embedded systems that demand reliable non-volatile storage across extreme conditions.
As a fully managed memory solution, the KLM8G1GEUF-B04P handles wear leveling, bad block management, and ECC internally through Samsung’s flash translation layer (FTL), allowing the host processor to interface using the standard MMC protocol without managing raw NAND complexity. It supports HS400 mode at 200MHz DDR for high sequential bandwidth and is backward compatible with prior MultiMediaCard system specifications.
Key Features
- Density: 8GB (64 Gb MLC NAND), user density 91.0%
- Standard: Embedded MultiMediaCard (eMMC) Ver. 5.1, JEDEC compliant
- Interface mode: HS400 (200MHz DDR); MMC I/F clock 0 ~ 200MHz, boot frequency 0 ~ 52MHz
- Data bus width: 1-bit (default), 4-bit, and 8-bit
- Package: 153-ball FBGA, 11.5 x 13.0 mm
- Supply voltage: Interface power VCCQ 1.70 ~ 1.95V or 2.7 ~ 3.6V; Memory power VCC 2.7 ~ 3.6V
- Operating temperature: -40 C to +95 C (automotive extended temperature, “P” suffix)
- Supported features: Packed command, Cache, Discard, Sanitize, Power Off Notification, Data Tag, Partition types, Context ID, Real Time Clock, Dynamic Device Capacity, HS200, Command Queuing, Enhanced Strobe
Applications
- Automotive infotainment, telematics, and navigation systems
- Instrument clusters and digital cockpit modules
- Industrial embedded computing and edge gateways
- IoT and consumer electronics requiring rugged managed storage
- Wearables and portable devices
Why Source KLM8G1GEUF-B04P from Pacific Component Xchange
Automotive memory like the KLM8G1GEUF-B04P is frequently constrained at authorized channels, with long lead times and limited availability for legacy or allocated densities. Pacific Component Xchange is an independent distributor specializing in hard-to-find and obsolete memory, helping engineers and supply-chain teams keep production lines running.
Every order is backed by our commitment to authenticity, rigorous incoming inspection, and global shipping. Whether you need support for an end-of-life build or volume for ongoing automotive production, our team can help you secure genuine product on your timeline. Request a quote (RFQ) for KLM8G1GEUF-B04P today and our sourcing specialists will respond with availability and pricing.
Additional Information
| Manufacturer | Samsung |
|---|---|
| Component Type | eMMC 5.1 (Automotive Managed NAND) |
| Density | 8GB |
| Organization | 64 Gb MLC NAND, user density 91.0% |
| NAND Flash Type | MLC |
| Package | 153 FBGA (11.5 x 13.0 mm) |
| Speed/Grade | HS400, up to 200MHz DDR |
| Supply Voltage | VCCQ 1.70-1.95V or 2.7-3.6V; VCC 2.7-3.6V |
| Temp Range | -40 C to +95 C (automotive extended temperature) |
| Part Status | Active |
| Availability | Available |

