What is the Samsung K4UBE3D4AA-MGCR?

It is a 32Gb (dual-die package) LPDDR4X SDRAM from Samsung in a 200-ball FBGA. It is internally organized as 64M x 32 DQ x 8 banks x 2 channels and runs at data rates up to 4266Mbps.

Is the K4UBE3D4AA-MGCR still in production?

No. Samsung lists this product as discontinued, so it is no longer readily available through authorized distribution. Pacific Component Xchange stocks it as a hard-to-find/obsolete part.

What are the supply voltages for this LPDDR4X device?

Per the Samsung datasheet, the supplies are VDD1 = 1.8V, VDD2 = 1.1V, and VDDQ = 0.6V.

What package does the K4UBE3D4AA-MGCR use?

It is supplied in a 200-ball FBGA package with a 10 x 15 mm body size.

What is the maximum data rate of the K4UBE3D4AA-MGCR?

The device supports speed bins of 3200, 3733, and 4266 Mbps, with a maximum of 4266Mbps (tCK = 0.468ns). Higher speed bins are backward compatible with lower ones.

How do I buy or get a price for the K4UBE3D4AA-MGCR?

This is a Request-For-Quote item. Submit an RFQ to Pacific Component Xchange with your required quantity and our sourcing team will confirm current availability, lead time, and pricing.

K4UBE3D4AA-MGCR – LPDDR4X SDRAM – Samsung

The Samsung K4UBE3D4AA-MGCR is a 32Gb (DDP) LPDDR4X SDRAM in a 200-ball FBGA package, rated up to 4266Mbps. Now discontinued and available for RFQ from Pacific Component Xchange.

Brand:Samsung

SKU: K4UBE3D4AA-MGCR Categories: Electronic Parts, RFQ

Please contact us or add to quote for current pricing and availability.

The Samsung K4UBE3D4AA-MGCR is a 32-gigabit (32Gb) Low-Power DDR4X (LPDDR4X) SDRAM supplied in a dual-die package (DDP). It is a high-bandwidth, low-power mobile memory device packaged in a compact 200-ball FBGA measuring 10 x 15 mm. The device is internally organized as 64M x 32 DQ x 8 banks x 2 channels and operates at data rates up to 4266Mbps, making it well suited for space- and power-constrained mobile and embedded designs.

This component has been discontinued by Samsung, which makes it difficult to source through authorized distribution channels. Pacific Component Xchange maintains inventory of this hard-to-find part to support production, service, and end-of-life builds.

Key Features

Memory type: LPDDR4X SDRAM (JEDEC low-power DDR4X)
Density: 32Gb (dual-die package / DDP)
Organization: 64M x 32 DQ x 8 banks x 2 channels
Speed bins: 3200 / 3733 / 4266 Mbps; maximum 4266Mbps (tCK = 0.468ns)
Supply voltages: VDD1 / VDD2 / VDDQ = 1.8V / 1.1V / 0.6V
Package: 200-ball FBGA, 10 x 15 mm body
Operating case temperature (Tc): -25 C to +85 C
Double-data-rate architecture (two data transfers per clock cycle)
Backward compatible: 4266Mbps to 3733Mbps to 3200Mbps

Applications

Smartphones and tablets
Automotive infotainment and ADAS modules
Edge computing and AI inference modules
Single-board computers and embedded systems
Networking and IoT gateway hardware

Why Source K4UBE3D4AA-MGCR from Pacific Component Xchange

As an independent distributor specializing in hard-to-find and obsolete memory, Pacific Component Xchange helps engineers and procurement teams secure discontinued devices like the K4UBE3D4AA-MGCR that are no longer available through franchised channels. Every order is backed by our authenticity and quality-assurance processes to protect your build against counterfeit and substandard parts. We offer global shipping and responsive RFQ support. Request a quote today and our sourcing team will confirm current availability, lead time, and pricing for your required quantity.

Additional Information

Manufacturer	Samsung
Component Type	LPDDR4X SDRAM
Density	32Gb (DDP / dual-die)
Organization	64M x 32 DQ x 8 banks x 2 channels
Package	FBGA-200 (10 x 15 mm)
Speed/Grade	3200 / 3733 / 4266 Mbps (max 4266Mbps, tCK 0.468ns)
Supply Voltage	VDD1/VDD2/VDDQ = 1.8V/1.1V/0.6V
Temp Range	Tc = -25 C to +85 C
Part Status	Obsolete / Discontinued
Availability	Available