
K4F8E3S4HD-GFCL – LPDDR4 SDRAM – Samsung
The Samsung K4F8E3S4HD-GFCL is an 8Gb automotive-grade LPDDR4 SDRAM rated up to 4266Mbps in a 200-ball FBGA (10x15mm) package, with a -40°C to +95°C operating temperature range. This discontinued, hard-to-find device is available for RFQ at Pacific Component Xchange.
The Samsung K4F8E3S4HD-GFCL is an 8Gb (8 gigabit) automotive-grade LPDDR4 SDRAM built on Samsung’s 5th-generation low-power DRAM process. Internally organized as 32M x16DQ x8 banks x2 channels per die and presented as a mono x32 LPDDR4 device, it delivers high bandwidth at low power for space- and thermally-constrained automotive and embedded designs. The device is supplied in a 200-ball Fine-pitch Ball Grid Array (FBGA) measuring 10x15mm, making it well suited for compact module and System-in-Package integration.
Qualified to Samsung’s automotive mission profile, the “F” temperature grade in this part number specifies an extended operating range of -40°C to +95°C, while the companion K4F8E3S4HD-GHCL variant covers -40°C to +105°C. The K4F8E3S4HD-GFCL is now discontinued by Samsung, which makes it a hard-to-find part for sustaining engineering, repair, and end-of-life production builds.
Key Features
- Memory type: LPDDR4 SDRAM (low-power DDR4), automotive datasheet
- Density: 8Gb
- Organization: 32M x16DQ x8 banks x2 channels per die; x32 mono LPDDR4
- Speed: Up to 4266Mbps (tCK = 0.468ns); supports 3200 / 3733 / 4266 Mbps speed bins, backward compatible to lower frequencies
- Supply voltages: VDD1 / VDD2 / VDDQ = 1.8V / 1.1V / 1.1V
- Burst length: 16, 32 (on-the-fly), sequential burst type
- Refresh: Partial Array Self Refresh (PASR) and Temperature Compensated Self Refresh (TCSR); tREFI = 3.9us, tREFW = 32ms at Tcase 85°C
- Operating temperature: -40°C to +95°C (automotive, “F” grade)
- Package: 200-ball FBGA, 10x15mm, 0.41mm solder ball, SAC302, Ni/Au finish
- Generation: Samsung 5th-generation LPDDR4
Applications
- Automotive infotainment and in-vehicle telematics systems
- Advanced driver-assistance systems (ADAS) and digital instrument clusters
- Automotive SoC and application-processor main memory
- Industrial and embedded computing requiring extended temperature DRAM
- Edge AI and high-bandwidth embedded modules
Why Source K4F8E3S4HD-GFCL from Pacific Component Xchange
Pacific Component Xchange is an independent distributor specializing in hard-to-find, obsolete, and end-of-life memory. Because the K4F8E3S4HD-GFCL has been discontinued by Samsung and has little to no authorized-distributor availability, securing genuine stock is increasingly difficult. We help engineers and procurement teams keep automotive and embedded production lines running with verified inventory.
Every order is backed by our commitment to authenticity and quality, including inspection and counterfeit-avoidance processes, with global shipping to support your timeline wherever you build.
Request a quote (RFQ) today to get current pricing, lead time, and date-code/availability details for the Samsung K4F8E3S4HD-GFCL. Our team responds quickly so you can lock in supply for this scarce automotive LPDDR4 device.
Additional Information
| Manufacturer | Samsung |
|---|---|
| Component Type | LPDDR4 SDRAM (Automotive) |
| Density | 8Gb |
| Organization | 32M x16DQ x8 banks x2 channels per die; x32 mono LPDDR4 |
| Package | 200-ball FBGA, 10x15mm (0.41mm solder ball, SAC302, Ni/Au) |
| Speed/Grade | Up to 4266Mbps, tCK=0.468ns (3200/3733/4266 speed bins) |
| Supply Voltage | VDD1 1.8V / VDD2 1.1V / VDDQ 1.1V |
| Temp Range | -40°C to +95°C (automotive, F grade) |
| Burst Length | 16, 32 (OTF), sequential |
| Generation | Samsung 5th-generation LPDDR4 |
| Part Status | Discontinued / Obsolete |
| Availability | Available |

