K4A8G165WG-BCWE – DDR4 SDRAM – Samsung

The Samsung K4A8G165WG-BCWE is an 8Gb DDR4 SDRAM organized as 512M x16, rated at 3200Mbps (DDR4-3200, CL22) and operating at 1.2V in a 96-ball FBGA package. Available now for RFQ from Pacific Component Xchange.

The Samsung K4A8G165WG-BCWE is an 8-gigabit DDR4 SDRAM (G-die) component organized as 512M x16. Built to the JEDEC DDR4 standard, it delivers a data rate of 3200Mbps (DDR4-3200) with a CAS latency of CL22 while operating from a 1.2V supply, making it a strong fit for bandwidth-hungry, power-conscious designs. The device is supplied in a compact 96-ball FBGA package using the SSTL_12 interface and is rated for the commercial temperature range of 0°C to +85°C.

Key Features

• Memory type: DDR4 SDRAM (JEDEC-compliant)
• Density: 8Gb
• Organization: 512M x16
• Data rate: 3200Mbps (DDR4-3200)
• CAS latency: CL22 @ 3200Mbps
• Supply voltage: 1.2V (VDD/VDDQ)
• I/O interface: SSTL_12
• Package: 96-ball FBGA
• Operating temperature: 0°C to +85°C (commercial)
• Die: Samsung G-die

Applications

• Servers and data-center systems
• Networking and telecom equipment
• Industrial control and embedded computing
• Desktop and notebook platforms
• High-performance edge and AI hardware

Why Source K4A8G165WG-BCWE from Pacific Component Xchange

Pacific Component Xchange is an independent distributor specializing in hard-to-find and obsolete memory. The K4A8G165WG-BCWE can be difficult to secure through authorized channels, and we maintain access to inventory to keep your production lines and service programs running. Every order is backed by our authenticity and quality controls, with rigorous inspection on memory components to protect against counterfeit and non-conforming parts. We support buyers worldwide with responsive quoting and global shipping. Request a quote (RFQ) today and our team will respond quickly with pricing and lead time for your required quantity.