
K4A8G165WC-BCWE – DDR4 SDRAM – Samsung
The Samsung K4A8G165WC-BCWE is an 8Gb DDR4 SDRAM C-die device organized as 512M x16 in a 96-ball FBGA package, operating at 1.2V. Available now for RFQ from Pacific Component Xchange.
The Samsung K4A8G165WC-BCWE is an 8Gb DDR4 SDRAM memory device from Samsung’s C-die family, organized as 512M x16 and supplied in a compact 96-ball FBGA package. Built on the JEDEC DDR4 standard, it delivers high-bandwidth, low-power double-data-rate operation from a single 1.2V supply, making it a versatile choice for memory subsystems across computing, networking, and embedded applications.
As an x16 component, a single K4A8G165WC-BCWE provides a 16-bit data interface, allowing designers to reach a desired total bus width with fewer devices and a smaller board footprint. The C-die process generation offers improved power efficiency and reliability features inherent to the DDR4 architecture, including On-Die Termination (ODT), programmable CAS Write Latency (CWL), internal (self) calibration via the ZQ pin, and Connectivity Test (TEN) mode support, which is required on x16 devices.
Key Features
- Memory type: DDR4 SDRAM (Samsung 8Gb C-die)
- Density: 8 Gb
- Organization: 512M x16 (64Mbit x 16 I/Os x 8 banks)
- Package: 96-ball FBGA, Lead-Free and Halogen-Free (RoHS compliant)
- Supply voltage: VDD / VDDQ = 1.2V (1.14V-1.26V); VPP = 2.5V (2.375V-2.75V)
- Architecture: 8n-bit prefetch, burst length 8 (BC4 supported), x16 organization using bank group BG0
- DDR4 features: On-Die Termination, programmable CWL, internal self-calibration, asynchronous reset, CRC for read/write data security, Connectivity Test (TEN) mode
- Operating temperature: Normal Range 0-85°C TCASE and Extended Range 85-95°C TCASE per the device specification
Applications
- Desktop, notebook, and server memory modules
- Networking, switching, and telecom line cards
- Industrial and embedded computing platforms
- Graphics, imaging, and high-bandwidth buffering
- Single-board computers and edge/IoT gateways
Why Source K4A8G165WC-BCWE from Pacific Component Xchange
Samsung DRAM allocations and date-code-specific lots can be difficult to secure through authorized channels, especially for ongoing builds and legacy production lines. Pacific Component Xchange is an independent distributor specializing in hard-to-find and obsolete memory, and we currently have inventory of the K4A8G165WC-BCWE available for quote.
Every order is backed by our commitment to authenticity and quality, including counterfeit-avoidance inspection and verification procedures to protect your production. We support global shipping and flexible quantities, whether you need a single reel or full-volume coverage for a multi-year program.
Need pricing, lead time, or date codes? Request a quote (RFQ) today and our sourcing team will respond promptly with current availability for the Samsung K4A8G165WC-BCWE.
Additional Information
| Manufacturer | Samsung |
|---|---|
| Component Type | DDR4 SDRAM (8Gb C-die) |
| Density | 8 Gb |
| Organization | 512M x16 |
| Package | 96-ball FBGA (Lead-Free, Halogen-Free) |
| Speed/Grade | DDR4-3200 |
| Supply Voltage | 1.2V VDD/VDDQ; 2.5V VPP |
| Temp Range | 0-85°C (Normal) / 85-95°C (Extended) TCASE |
| Part Status | Active |
| Availability | Available |


