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K4A8G165WC-BCWE – DDR4 SDRAM – Samsung

The Samsung K4A8G165WC-BCWE is an 8Gb DDR4 SDRAM C-die device organized as 512M x16 in a 96-ball FBGA package, operating at 1.2V. Available now for RFQ from Pacific Component Xchange.

Brand:Samsung
SKU: K4A8G165WC-BCWE Categories: ,
Please contact us or add to quote for current pricing and availability.

The Samsung K4A8G165WC-BCWE is an 8Gb DDR4 SDRAM memory device from Samsung’s C-die family, organized as 512M x16 and supplied in a compact 96-ball FBGA package. Built on the JEDEC DDR4 standard, it delivers high-bandwidth, low-power double-data-rate operation from a single 1.2V supply, making it a versatile choice for memory subsystems across computing, networking, and embedded applications.

As an x16 component, a single K4A8G165WC-BCWE provides a 16-bit data interface, allowing designers to reach a desired total bus width with fewer devices and a smaller board footprint. The C-die process generation offers improved power efficiency and reliability features inherent to the DDR4 architecture, including On-Die Termination (ODT), programmable CAS Write Latency (CWL), internal (self) calibration via the ZQ pin, and Connectivity Test (TEN) mode support, which is required on x16 devices.

Key Features

  • Memory type: DDR4 SDRAM (Samsung 8Gb C-die)
  • Density: 8 Gb
  • Organization: 512M x16 (64Mbit x 16 I/Os x 8 banks)
  • Package: 96-ball FBGA, Lead-Free and Halogen-Free (RoHS compliant)
  • Supply voltage: VDD / VDDQ = 1.2V (1.14V-1.26V); VPP = 2.5V (2.375V-2.75V)
  • Architecture: 8n-bit prefetch, burst length 8 (BC4 supported), x16 organization using bank group BG0
  • DDR4 features: On-Die Termination, programmable CWL, internal self-calibration, asynchronous reset, CRC for read/write data security, Connectivity Test (TEN) mode
  • Operating temperature: Normal Range 0-85°C TCASE and Extended Range 85-95°C TCASE per the device specification

Applications

  • Desktop, notebook, and server memory modules
  • Networking, switching, and telecom line cards
  • Industrial and embedded computing platforms
  • Graphics, imaging, and high-bandwidth buffering
  • Single-board computers and edge/IoT gateways

Why Source K4A8G165WC-BCWE from Pacific Component Xchange

Samsung DRAM allocations and date-code-specific lots can be difficult to secure through authorized channels, especially for ongoing builds and legacy production lines. Pacific Component Xchange is an independent distributor specializing in hard-to-find and obsolete memory, and we currently have inventory of the K4A8G165WC-BCWE available for quote.

Every order is backed by our commitment to authenticity and quality, including counterfeit-avoidance inspection and verification procedures to protect your production. We support global shipping and flexible quantities, whether you need a single reel or full-volume coverage for a multi-year program.

Need pricing, lead time, or date codes? Request a quote (RFQ) today and our sourcing team will respond promptly with current availability for the Samsung K4A8G165WC-BCWE.

Additional Information

Manufacturer

Samsung

Component Type

DDR4 SDRAM (8Gb C-die)

Density

8 Gb

Organization

512M x16

Package

96-ball FBGA (Lead-Free, Halogen-Free)

Speed/Grade

DDR4-3200

Supply Voltage

1.2V VDD/VDDQ; 2.5V VPP

Temp Range

0-85°C (Normal) / 85-95°C (Extended) TCASE

Part Status

Active

Availability

Available